Core

Our Substrate
Solutions

Enabling the next era ofAI & High-Performance Computing

Get in Touch

Get in Touch

Our Technology

Our Technology

Our Mission

We strive to build the foundation for next-generation computing through breakthrough glass substrate technology, enabling scalable AI infrastructure, high-performance computing, and semiconductor innovation with advanced packaging solutions

We strive to build the foundation for next-generation computing through breakthrough glass substrate technology, enabling scalable AI infrastructure, high-performance computing, and semiconductor innovation with advanced packaging solutions

Message From Our CEO

At Absolics, innovation is built through teamwork, disciplined execution, and a shared commitment to meaningful progress. We are proud to advance glass substrate technology that supports our customers, partners, and employees while helping shape the next era of semiconductor packaging. - Jiho Kang

At Absolics, innovation is built through teamwork, disciplined execution, and a shared commitment to meaningful progress. We are proud to advance glass substrate technology that supports our customers, partners, and employees while helping shape the next era of semiconductor packaging. - Jiho Kang

September • 2018

The Start

Absolics started by asking, 'What’s next?' When silicon hit a physical wall, we redefined the foundation of computing with glass

Our Team Culture

Grew to a team of 16 passionate individuals, each bringing unique skills to the table.

Meet the Team
Feasibilty Test
December • 2019

Feasibilty Test

Absolics advanced from concept to validation, conducting feasibility testing to confirm the potential of glass as a next-generation substrate platform.

Feasibilty Test

Absolics advanced from concept to validation, conducting feasibility testing to confirm the potential of glass as a next-generation substrate platform.

Absolics Establishment Approval
November • 2021

Absolics Establishment Approval

With a bold concept in hand, we secured the backing of SK Group to bring glass substrates to life

MVP Success

Absolics Establishment approval by SK Group

See the Journey
SVM Groundbreaking Ceremony
November • 2022

SVM Groundbreaking Ceremony

Moving from the design board to the dirt. We broke ground on our SVM facility to turn glass packaging into a scalable reality

$5M Funding

Raised $5M to accelerate growth. Investors believed in our vision for the future.

Investment Details
U.S. CHIPS Act Manufacturing subsidy approved ($75M)
May • 2024

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

2024 • completion

SVM Completion and Commissioning

Blueprint to reality. Construction is complete on our premier testing ground for high-density packaging.

Going Global

Opened offices in London and Singapore, now serving customers across 40+ countries.

Our Locations
December • 2024

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

2026 • future

Shaping the Next Era

The future isn't a concept, it's actively running on our lines. Driving global commercialization to dominate the high-performance computing market.

Shaping the Next Era

The future isn't a concept, it's actively running on our lines. Driving global commercialization to dominate the high-performance computing market.

Our Story

Pioneering Glass Core Tech

Born from a vision to break through traditional scaling limits, we engineered a revolutionary glass substrate platform to serve as the definitive foundation for the future of computing.

September • 2018

The Start

Absolics started by asking, 'What’s next?' When silicon hit a physical wall, we redefined the foundation of computing with glass

Our Team Culture

Grew to a team of 16 passionate individuals, each bringing unique skills to the table.

Meet the Team
Feasibilty Test
December • 2019

Feasibilty Test

Absolics advanced from concept to validation, conducting feasibility testing to confirm the potential of glass as a next-generation substrate platform.

Feasibilty Test

Absolics advanced from concept to validation, conducting feasibility testing to confirm the potential of glass as a next-generation substrate platform.

Absolics Establishment Approval
November • 2021

Absolics Establishment Approval

With a bold concept in hand, we secured the backing of SK Group to bring glass substrates to life

MVP Success

Absolics Establishment approval by SK Group

See the Journey
SVM Groundbreaking Ceremony
November • 2022

SVM Groundbreaking Ceremony

Moving from the design board to the dirt. We broke ground on our SVM facility to turn glass packaging into a scalable reality

$5M Funding

Raised $5M to accelerate growth. Investors believed in our vision for the future.

Investment Details
U.S. CHIPS Act Manufacturing subsidy approved ($75M)
May • 2024

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

2024 • completion

SVM Completion and Commissioning

Blueprint to reality. Construction is complete on our premier testing ground for high-density packaging.

Going Global

Opened offices in London and Singapore, now serving customers across 40+ countries.

Our Locations
December • 2024

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

2026 • future

Shaping the Next Era

The future isn't a concept, it's actively running on our lines. Driving global commercialization to dominate the high-performance computing market.

Shaping the Next Era

The future isn't a concept, it's actively running on our lines. Driving global commercialization to dominate the high-performance computing market.

2019 • Founded

The Beginning

It started by asking, 'What’s next?' When silicon hit a physical wall, we redefined the foundation of computing with glass

The Beginning

Started with a simple idea and a determination to build something meaningful. Late nights, endless coffee, and the first lines of code.

Read Our Story
Absolics Establishment Approval
2020 • MVP Launch

Absolics Establishment Approval

With a bold concept in hand, we secured the backing of SK Group to bring glass substrates to life

MVP Success

Absolics Establishment approval by SK Group

See the Journey
2021 • Team Growth

Building The Team

With a greenlight in hand, we built the specialized engineering team required to pioneer next-gen advanced packaging.

Our Team Culture

Grew to a team of 16 passionate individuals, each bringing unique skills to the table.

Meet the Team
SVM groundbreaking ceremony
2022 • Funding

SVM groundbreaking ceremony

Moving from the design board to the dirt. We broke ground on our SVM facility to turn glass packaging into a scalable reality

$5M Funding

Raised $5M to accelerate growth. Investors believed in our vision for the future.

Investment Details
Global expansion
2023 • Expansion

SVM Completion and commissioning

Blueprint to reality. Construction is complete on our premier testing ground for high-density packaging.

Going Global

Opened offices in London and Singapore, now serving customers across 40+ countries.

Our Locations
2024 • Milestone 6

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

U.S. CHIPS Act Manufacturing subsidy approved ($75M)

Federal backing secured. Accelerating our domestic manufacturing timeline to anchor the U.S. semiconductor packaging ecosystem.

2024 • Milestone 7

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

U.S. CHIPS Act R&D subsidy approved ($100M)

Advancing technical leadership. Expanding our R&D roadmap to pioneer next-generation glass substrate innovations.

2024 • Milestone 8

The Rest it Still Unwritten

Description of this milestone.

The Rest it Still Unwritten

Description of this milestone.

Glass Substrate

Our Technology

The substrate that powers next-generation AI.

Glass Substrate

inProut™

Glass Substrate

inProut™

Product

inProut™  Glass Substrate

Innovative glass-core platform engineered to eliminate traditional silicon bottlenecks, accelerating data velocity and energy efficiency

Panel Handling

1. Automation-Driven Manufacturing Robotic panel transport ensures accurate, consistent handling for efficient, scalable production 2. Data-Driven Quality and Yield Protection Sensors and IoT offer real-time monitoring to detect issues early and maintain quality 3. Safe, and Efficient Operations Ergonomic systems reduce manual work, enhance safety, and improve efficiency for high-volume manufacturing

Learn More

Device Embedding

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Learn More

Tailored Reliability

1. Device Integration for Performance and Density Embedding passives into the substrate reduces footprint, shortens electrical paths, and improves SI/PI per unit area 2. Active Device Embedding Advanced techniques for embedding active devices, enable higher system functionality, reduced latency, and tighter integration within the package 3. Thermal‑Aware Embedded Design Integrated thermal management solutions effectively dissipate heat from embedded components, ensuring reliability and sustained performance

Learn More

Panel Handling

1. Automation-Driven Manufacturing Robotic panel transport ensures accurate, consistent handling for efficient, scalable production 2. Data-Driven Quality and Yield Protection Sensors and IoT offer real-time monitoring to detect issues early and maintain quality 3. Safe, and Efficient Operations Ergonomic systems reduce manual work, enhance safety, and improve efficiency for high-volume manufacturing

Device Embedding

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Learn More

Tailored Reliability

1. Device Integration for Performance and Density Embedding passives into the substrate reduces footprint, shortens electrical paths, and improves SI/PI per unit area 2. Active Device Embedding Advanced techniques for embedding active devices, enable higher system functionality, reduced latency, and tighter integration within the package 3. Thermal‑Aware Embedded Design Integrated thermal management solutions effectively dissipate heat from embedded components, ensuring reliability and sustained performance

Learn More

Manufacturing and Intelligent Design

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Learn More

Ultra‑Fine Interconnections

1. Ultra-Fine BVH Interconnections Precision micro‑via formation using advanced drilling technologies enables aggressive miniaturization and reliable interconnects for next‑generation, high‑density circuit designs 2. Fine-Pitch Die Interconnect Scaling Continuous reduction of micro‑bump size and pitch delivers significantly higher I/O density, supporting advanced chiplet‑based packaging architectures 3. Contactless, Automated Electrical Inspection Non‑contact electrical inspection ensures consistent, damage‑free testing, improving yield, throughput

Learn More

AI‑Driven Manufacturing Intelligence

1. Real-Time Process Optimization AI analyzes manufacturing data to optimize processes, boost yield, reduce defects, and enhance efficiency 2. Predictive Maintenance and Intelligent Q Control AI predicts equipment failures and detects defects early, reducing downtime and safeguarding yield 3. AI-Enabled Design and Decision Intelligence AI speeds up product design and process development by providing simulations and data-driven insights for quicker decisions

Learn More

Manufacturing and Intelligent Design

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Ultra‑Fine Interconnections

1. Ultra-Fine BVH Interconnections Precision micro‑via formation using advanced drilling technologies enables aggressive miniaturization and reliable interconnects for next‑generation, high‑density circuit designs 2. Fine-Pitch Die Interconnect Scaling Continuous reduction of micro‑bump size and pitch delivers significantly higher I/O density, supporting advanced chiplet‑based packaging architectures 3. Contactless, Automated Electrical Inspection Non‑contact electrical inspection ensures consistent, damage‑free testing, improving yield, throughput

Learn More

AI‑Driven Manufacturing Intelligence

1. Real-Time Process Optimization AI analyzes manufacturing data to optimize processes, boost yield, reduce defects, and enhance efficiency 2. Predictive Maintenance and Intelligent Q Control AI predicts equipment failures and detects defects early, reducing downtime and safeguarding yield 3. AI-Enabled Design and Decision Intelligence AI speeds up product design and process development by providing simulations and data-driven insights for quicker decisions

Learn More

Panel Handling

Automation-Driven Manufacturing, Data-Driven Quality and Yield Protection, Safe, and Efficient Operations

Device Embedding

Device Integration for Performance and Density, Active Device Embedding, Thermal‑Aware Embedded Design

Tailored Reliability

Inherent Crack Resistance, Enhanced Interface Integrity, Thermal Reliability

MFG and Intelligent Design

Accurate Manufacturing, Efficient Miniaturization, Optimized Design Density

Ultra‑Fine Interconnections

Ultra-Fine BVH Interconnections, Fine-Pitch Die Interconnect Scaling, Contactless, Automated Electrical Inspection

AI‑Driven MFG Intelligence

Real-Time Process Optimization, Predictive Maintenance and Intelligent Q Control, AI-Enabled Design and Decision Intelligence

Product

inProut™  Glass Substrate

Innovative glass-core platform engineered to eliminate traditional silicon bottlenecks, accelerating data velocity and energy efficiency

Panel Handling

1. Automation-Driven Manufacturing Robotic panel transport ensures accurate, consistent handling for efficient, scalable production 2. Data-Driven Quality and Yield Protection Sensors and IoT offer real-time monitoring to detect issues early and maintain quality 3. Safe, and Efficient Operations Ergonomic systems reduce manual work, enhance safety, and improve efficiency for high-volume manufacturing

Device Embedding

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Learn More

Tailored Reliability

1. Device Integration for Performance and Density Embedding passives into the substrate reduces footprint, shortens electrical paths, and improves SI/PI per unit area 2. Active Device Embedding Advanced techniques for embedding active devices, enable higher system functionality, reduced latency, and tighter integration within the package 3. Thermal‑Aware Embedded Design Integrated thermal management solutions effectively dissipate heat from embedded components, ensuring reliability and sustained performance

Learn More

Panel Handling

1. Automation-Driven Manufacturing Robotic panel transport ensures accurate, consistent handling for efficient, scalable production 2. Data-Driven Quality and Yield Protection Sensors and IoT offer real-time monitoring to detect issues early and maintain quality 3. Safe, and Efficient Operations Ergonomic systems reduce manual work, enhance safety, and improve efficiency for high-volume manufacturing

Device Embedding

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Learn More

Tailored Reliability

1. Device Integration for Performance and Density Embedding passives into the substrate reduces footprint, shortens electrical paths, and improves SI/PI per unit area 2. Active Device Embedding Advanced techniques for embedding active devices, enable higher system functionality, reduced latency, and tighter integration within the package 3. Thermal‑Aware Embedded Design Integrated thermal management solutions effectively dissipate heat from embedded components, ensuring reliability and sustained performance

Learn More

Manufacturing and Intelligent Design

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Ultra‑Fine Interconnections

1. Ultra-Fine BVH Interconnections Precision micro‑via formation using advanced drilling technologies enables aggressive miniaturization and reliable interconnects for next‑generation, high‑density circuit designs 2. Fine-Pitch Die Interconnect Scaling Continuous reduction of micro‑bump size and pitch delivers significantly higher I/O density, supporting advanced chiplet‑based packaging architectures 3. Contactless, Automated Electrical Inspection Non‑contact electrical inspection ensures consistent, damage‑free testing, improving yield, throughput

Learn More

AI‑Driven Manufacturing Intelligence

1. Real-Time Process Optimization AI analyzes manufacturing data to optimize processes, boost yield, reduce defects, and enhance efficiency 2. Predictive Maintenance and Intelligent Q Control AI predicts equipment failures and detects defects early, reducing downtime and safeguarding yield 3. AI-Enabled Design and Decision Intelligence AI speeds up product design and process development by providing simulations and data-driven insights for quicker decisions

Learn More

Manufacturing and Intelligent Design

1. Accurate Manufacturing Advanced tools and know-hows to process precise dense structures in limited spaces 2. Efficient Miniaturization Unique methods shrink size while preserving electrical, thermal, and mechanical performance 3. Optimized Design Density Maximize PKG space utilization by improving routing efficiency, signal quality

Ultra‑Fine Interconnections

1. Ultra-Fine BVH Interconnections Precision micro‑via formation using advanced drilling technologies enables aggressive miniaturization and reliable interconnects for next‑generation, high‑density circuit designs 2. Fine-Pitch Die Interconnect Scaling Continuous reduction of micro‑bump size and pitch delivers significantly higher I/O density, supporting advanced chiplet‑based packaging architectures 3. Contactless, Automated Electrical Inspection Non‑contact electrical inspection ensures consistent, damage‑free testing, improving yield, throughput

Learn More

AI‑Driven Manufacturing Intelligence

1. Real-Time Process Optimization AI analyzes manufacturing data to optimize processes, boost yield, reduce defects, and enhance efficiency 2. Predictive Maintenance and Intelligent Q Control AI predicts equipment failures and detects defects early, reducing downtime and safeguarding yield 3. AI-Enabled Design and Decision Intelligence AI speeds up product design and process development by providing simulations and data-driven insights for quicker decisions

Learn More

Customers

Target Markets & Customers

MPUs for PC & Data Center · GPUs for AI and HPC · Custom ASICs

AI Accelerator GPUs

Standard Allocation

Large-die GPU/NPU packaging for datacenter AI training & inference — maximum SI/PI performance required.

Advanced Integration

Enterprise Scale

Built for advanced multi-die integration, with the precision and reliability required for next-generation packaging.

Hyperscale Data Centers

Enterprise Scale

Custom silicon for AI infrastructure — TPUs, DPUs, custom ASICs — where package efficiency drives total cost.

AI Accelerator GPUs

Standard Allocation

Large-die GPU/NPU packaging for datacenter AI training & inference — maximum SI/PI performance required.

Advanced Integration

Enterprise Scale

Built for advanced multi-die integration, with the precision and reliability required for next-generation packaging.

Hyperscale Data Centers

Enterprise Scale

Custom silicon for AI infrastructure — TPUs, DPUs, custom ASICs — where package efficiency drives total cost.

AI Accelerator GPUs

Standard Allocation

Large-die GPU/NPU packaging for datacenter AI training & inference — maximum SI/PI performance required.

Advanced Integration

Enterprise Scale

Built for advanced multi-die integration, with the precision and reliability required for next-generation packaging.

Hyperscale Data Centers

Enterprise Scale

Custom silicon for AI infrastructure — TPUs, DPUs, custom ASICs — where package efficiency drives total cost.

Our News

Latest News and Insights

Stay updated on Absolics’ milestones, innovations, and industry developments.

(01)

General

See More

(02)

Technology

See More

(03)

Strategic Partners

See More

(04)

Community Service

See More

(05)

Misc.

See More

(01)

General

See More

(02)

Technology

See More

(03)

Strategic Partners

See More

(04)

Community Service

See More

(05)

Misc.

See More

Join Us

Be Part of What's Next

We are looking for talented individuals who are ready to grow with us, contribute to meaningful innovation, and help define the next era of glass substrate technology.

Open Positions

Open Positions

Open Positions

Open Positions

Contact

Let's Talk Innovation

Have an idea, question, or opportunity in mind?
Connect with us to explore partnerships, collaborations, and ways we can help shape the future of advanced packaging together.

Open Positions

Open Positions

Inquiry Type

Visit Us

Find Us Offline At

Go To The Visitor Site

Go To The Visitor Site