Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart,
innovative services to dozens of clients globally.
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The advanced packaging market was up from $3.5B during 2020
Expected rapid growth at $9.7B in 2025
Glass substrate is a key material for advanced packaging technology innovation, with a growth forecast (25% CAGR) from $1.0B in 2020 to $3.0B in 2025.
The industry is facing limitations in the front-end process of semiconductor chip manufacturing
Facing rapid growth in demand for fine pattern, large area, and low power substrates
Significant improvement in signaling characteristics and power consumption compared to existing solutions is possible through large glass substrates with built-in active and passive elements.