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Product
Absolics glass substrates provide differentiated value such as high performance/low power consumption/form factor to HPC-related package companies, Data Center, AI, etc.
40% performance improvement vs. previous performance
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Low power
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High frequency
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Next-generation I/O
Application of more advanced package substrate design technology
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More Chip Packaging
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More accelerators
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High speed Communications
Reduced package thickness
Simplified structure by substrate integration
CPU/GPU size and memory upgrade
→ Dramatically increased data process speed
40% improvement in SI, 50% improvement in PI
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