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Absolics glass substrates provide differentiated value such as high performance/low power consumption/form factor to HPC-related package companies, Data Center, AI, etc.​

40% performance improvement vs. previous performance

  • Low power

  • High frequency

  • Next-generation I/O

Application of more advanced package substrate design technology

  • More Chip Packaging

  • More accelerators

  • High speed Communications

Reduced package thickness​
Simplified structure by substrate integration

CPU/GPU size and memory upgrade​
→ Dramatically increased data process speed​

40% improvement in SI, 50% improvement in PI

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