U.S. Department of Commerce Announces $1.4B in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

1/16/2025

$100M Investment Will Propel Absolics Inc., Georgia Tech’s Advanced Packaging Research

12/12/2024

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Awards

11/21/2024

Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging

5/23/2024

Sen. Ossoff Announces Historic Federal Investment in Georgia Semiconductor Manufacturing

5/23/2024

U.S. Department of Commerce Announces $1.4B in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

1/16/2025

$100M Investment Will Propel Absolics Inc., Georgia Tech’s Advanced Packaging Research

12/12/2024

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Awards

11/21/2024

Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging

5/23/2024

Sen. Ossoff Announces Historic Federal Investment in Georgia Semiconductor Manufacturing

5/23/2024

U.S. Department of Commerce Announces $1.4B in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

1/16/2025

$100M Investment Will Propel Absolics Inc., Georgia Tech’s Advanced Packaging Research

12/12/2024

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Awards

11/21/2024

Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging

5/23/2024

Sen. Ossoff Announces Historic Federal Investment in Georgia Semiconductor Manufacturing

5/23/2024